May 2, 2024 •
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| TP-2100 GEL TERMICO - Gap Filler Thermal Interface | |||
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| DOW CORNING | |||
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| www.dowcorning.com | |||
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| Dow Corning® TP-2100 Thermal Gap Pad | |||
| Dow Corning® TP-2100 Thermal Gap Pad is a cost-competitive, highly compressible silicone gel gap filler with moderate bulk conductivity. This gel uses foam reinforcement to maintain compressibility, while providing easy handling to simplify application and improve long-term reliability. It is ideal for use in low-power applications requiring heat transfer across any large air gap. |
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